Laptop BGA Rework ZM-R5860C BGA Rework station

1.Bga Rework station 2.high definition camera/LCD monitor 3.Good solution for laptop/desktop/server board/large game board

BGA Rework Station ZM-R5860C

1, Main Feature

1.Adopt liner slide which makes X, Y, Z axis all can do high positioning accuracy and fast maneuverability.

2. High definition touch screen made from Taiwan, PLC control, can save 50 groups profile and analyze instant temperatures curves, equipped with password protection and modify function. The temperature curves can be show on the touch screen. Instantly set and analyze temperature parameter according with repair need.

3. There are 3 independent heating areas from top to bottom, the 1st and 2nd hot-air heaters, can be set many temperatures parameters and sections at the same time. The 3rd IR preheating, prevent the PCB motherboard cracking, and can be adjusted the power consumption. Bottom IR heater ensure an even heater for PCB board. Top heater can be adjusted freely; second hot air heater can be adjusted up and down.

   The machine operations is easy to operate, human machine interface- high definition touch screen made from Taiwan

4. Offer all kinds of hot-air nozzle, it can rotate 360°, with magnet, easy to install and change, and offer customized service.

5. Choose imported high-precision K-type thermocouple, closed loop control and automatic temperature compensation system, combined PLC module for the precision control of temperature. Temperature controlled within ±3 °.

6. Use a V-groove flexible fixture for PCB positioning to protect the PCB from deformation when heated or cooled, and it can rework for any BGA package size.

7. Powerful cross-flow fan rapidly cool the PCB board, built-in vacuum pump and external vacuum suction pen, pick up the chips rapidly.

8. After finished desoldering & soldering, there is an alarming & alarming in advance.

9. CE certificate, with emergency stop and Automatic power-off protection device when abnormal accident happens. With a double over-heating protection control.

10. HD camera system, accurate judgments on the melting process during the BGA soldering and desoldering, provide critical vision.

And It can save many temperature parameters, easy to repair same chips. And can repair Lead or Lead free chips, can meet repair of laptop, xbox360, mobile, ps3 and other components on the motherboard.

2, Specifications and Technical parameters

1	Total Power	4850W
2	Top heater	800W
3	Bottom heater	2nd  heater 1200W,3rd IR heater 2700W
4	power	AC220V±10%     50/60Hz
5	Dimensions	L635*W600*H560 mm
6	Positioning	V-groove, PCB support can be adjusted in any direction and with external universal fixture
7	Temperature control	K-type thermocouple (Closed Loop), heating independently, temperature precision within ±3 degree
8	PCB size	Max 410*370mm      Min 20*20mm
9	Electrical materials	Taiwan touch screen + Delta PLC + high precision intelligent temperature control module
10	Net weight	40KG

 

3, Accessories list

item	name	quantity	unit
1	Fixture	6	pcs
2	M5*30Supporting screw	6	pcs
3	plum blossoms handle	6	pcs
4	Temperature sensor	1	pcs
5	Vacuum sucker	2	pcs
6	Nozzle 31*31	1	pcs
7	Nozzle 38*38	1	pcs
8	Nozzle 41*41	1	pcs
9	Nozzle 28*28	1	pcs
10	Nozzle 35*35	1	pcs
11	Brush	1	pcs
12	Manual	1	pcs
13	Hot air heater	2	pcs
14	IR heater	1	pcs
15	LCD monitor	1	pcs

Laptop BGA Rework ZM-R5860C BGA Rework station